²úÆ·ÓëÊг¡
Ê×Ò³ >
²úÆ·ÓëÊг¡
>³¬µÍ½éÖÊËðºÄ
Ñ¡Ôñ²úƷϵÁÐ
>
>
ÇëÑ¡Ôñ²úƷϵÁÐ
ÇëÑ¡Ôñ²úÆ·Àà±ð
ÖÇÄÜÖն˲úÆ·
³£¹æ¸ÕÐÔ²úÆ·
Æû³µ²úÆ·
ÉäƵÓë΢²¨²ÄÁÏ
½ðÊô»ù°åÓë¸ßµ¼ÈȲúÆ·
IC·â×°²úÆ·
ÈíÐÔ²ÄÁϲúÆ·
¸ßËÙ²úÆ·
ÌØÖÖ²úÆ·
- ¹ã¶«±ØÒ»Ô˶¯¹ÙÍø
- ËÕÖݱØÒ»Ô˶¯¹ÙÍø
- ³£Êì±ØÒ»Ô˶¯¹ÙÍø
- ÉÂÎ÷±ØÒ»Ô˶¯¹ÙÍø
- ½ËÕ±ØÒ»Ô˶¯¹ÙÍø
- ½Î÷±ØÒ»Ô˶¯¹ÙÍø
- GuangDong
- SuZhou
- ChangShu
- ShaanXi
- JiangSu
- JiangXi
- ½Î÷
- Ì©¹ú
- ¾Å½
- Environmental Material
- Extremely low-loss
- »·±£²ÄÁÏ
- HDI
- HDI
- Smart Terminal
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- Rigid Materials
- RF Materials
- Automotive Materials
- Flexible Materials
- IC Substrate Materials
- IMS and HTC materials
- Special Materials
- HSD Materials
- ÆäËü
- ³¬µÍ½éÖÊËðºÄ
- µÍ½éÖÊËðºÄ
- µþ²ãĸÅÅÓþøÔµ½ºÄ¤
- CEM-1
- CEM-3, CEM-3.1
- PTFE Type
- ÈȹÌÐÔÊ÷Ö¬Ìåϵ
- Ó²ÖʾÛõ£ÑÇ°·²ÄÁÏ
- °ëÄÓÐÔ²ÄÁÏ
- ÌØÖÖÕ³ºÏ²ÄÁÏ
- ÖеȽéÖÊËðºÄ
- ÂÁ»ù°å
- Í»ù°å
- ÄÓÐÔ¸²Í°å
- ¸²¸ÇĤ
- ½ºÄ¤
- ²¹Ç¿°å
- ³£¹æFR-4.0
- ÎÞǦ¼æÈÝFR-4.0, FR-15.0
- ÎÞ±ÎÞǦ¼æÈÝFR-4.1, FR-15.1
- IC Substrate
- Í¿Ê÷֬Ͳ
- ̼ÇâϵÁвúÆ·
- µ¼ÈÈFR-4.0
- Æû³µ²úÆ·
- ÖÇÄÜÖն˲úÆ·
- ³£¹æ¸ÕÐÔ²úÆ·
- Æû³µ²úÆ·
- ÉäƵÓë΢²¨²ÄÁÏ
- ½ðÊô»ù°åÓë¸ßµ¼ÈȲúÆ·
- IC·â×°²úÆ·
- ÈíÐÔ²ÄÁϲúÆ·
- ¸ßËÙ²úÆ·
- ÌØÖÖ²úÆ·
- 2018
- 2017
- 2016
- 2015
- 2014
- 2013
- 2011
- 2010
- 2007
- 2006
- 2004
- 2002
- 2000
- 1999
- 1998
- 1994
- 1990
- 1985
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
- 2018
- 2019
- 2020
- 2021
- 2022
- 2023
- 2024
- HDI
- HDI
- UL File (Download)
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- Conventional FR-4
- Lead Free Compatible FR-4.0, FR-15.0
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- CEM-3, CEM-3.1
- CEM-1
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- ̨Íå
- ¶«Ý¸
- ËÕÖÝ
- ÏÌÑô
- º«¹ú
- Å·ÖÞ
- ÃÀ¹úÖб±´óµÀ
- ÃÀ¹úÉÁÖ´óµÀ
- ÈÕ±¾
- ¶«ÄÏÑÇ
- °ÍÎ÷
- ¶«Ý¸Íò½
- ÏÌÑô
- ËÕÖÝ
- ³£Êì
- ÄÏͨ
- ¾Å½
- Ñз¢¼°¹¤³Ì»¯¶ÔÍâÒµÎñ
- ίÍвâÊÔ¶ÔÍâÒµÎñ
- ֪ʶ²úȨºÍ±ê×¼¶ÔÍâÒµÎñ
- È˲ÅÅàÑøºÍ¼¼ÊõÅàѵ
- CQC Certificate
- BSI Certificate
- JET Certificate
- VDE Certificate
- UL File (UL IQ link)
- Education
- Environmental Protection
- Society
- Shengyi Technology
- Shaanxi Shengyi
- Suzhou Shengyi
- Changshu Shengyi
- Jiangsu Shengyi
- Jiangxi Shengyi
- Hong Kong Shengyi
- Taiwan Shengyi
- ×ʽÌÖúѧ
- »·°²»î¶¯
- »ØÀ¡Éç»á
- ¹ã¶«±ØÒ»Ô˶¯¹ÙÍø
- ÉÂÎ÷±ØÒ»Ô˶¯¹ÙÍø
- ËÕÖݱØÒ»Ô˶¯¹ÙÍø
- ³£Êì±ØÒ»Ô˶¯¹ÙÍø
- ½ËÕ±ØÒ»Ô˶¯¹ÙÍø
- ½Î÷±ØÒ»Ô˶¯¹ÙÍø
- Ïã¸Û±ØÒ»Ô˶¯¹ÙÍø
- ̨Íå±ØÒ»Ô˶¯¹ÙÍø
- ̨Íå
- PTFE Type
- ÈȹÌÐÔÊ÷Ö¬Ìåϵ
- Ó²ÖʾÛõ£ÑÇ°·²ÄÁÏ
- °ëÄÓÐÔ²ÄÁÏ
- ÌØÖÖÕ³ºÏ²ÄÁÏ
- ÖеȽéÖÊËðºÄ
- µÍ½éÖÊËðºÄ
- ³¬µÍ½éÖÊËðºÄ
- ÄÓÐÔ¸²Í°å
- ¸²¸ÇĤ
- ²»Á÷¶¯PƬ
- ½ºÄ¤
- ²¹Ç¿°å
- µþ²ãĸÅÅÓþøÔµ½ºÄ¤
- ¶«Ý¸
- ËÕÖÝ
- ÏÌÑô
- º«¹ú
- Å·ÖÞ
- ÃÀ¹úÖб±´óµÀ
- ÃÀ¹úÉÁÖ´óµÀ
- ÈÕ±¾
- ¶«Ý¸Íò½
- ÏÌÑô
- ËÕÖÝ
- ³£Êì
- ÄÏͨ
- ¾Å½
- ¶«ÄÏÑÇ
- °ÍÎ÷
- ³£¹æFR-4.0
- ÎÞǦ¼æÈÝFR-4.0, FR-15.0
- ÎÞ±ÎÞǦ¼æÈÝFR-4.1, FR-15.1
- CEM-1
- CEM-3, CEM-3.1
- IC Substrate
- Í¿Ê÷֬Ͳ
- ̼ÇâϵÁвúÆ·
- ÂÁ»ù°å
- Í»ù°å
- µ¼ÈÈFR-4.0
- ÆäËü
- ULµµ°¸
- ULÈÏÖ¤£¨²éѯ£©
- CQCÈÏÖ¤
- BSIÈÏÖ¤
- JETÈÏÖ¤
- VDEÈÏÖ¤
- Èý»á¹æÔò
- ¹¤×÷ÖƶÈ
- ÄÚ²¿¿ØÖÆ
- Ñз¢¼°¹¤³Ì»¯¶ÔÍâÒµÎñ
- ίÍвâÊÔ¶ÔÍâÒµÎñ
- ֪ʶ²úȨºÍ±ê×¼¶ÔÍâÒµÎñ
- È˲ÅÅàÑøºÍ¼¼ÊõÅàѵ
- ÁªÏµ·½Ê½
- Æû³µ²úÆ·
- »·±£²ÄÁÏ
- HDI
- ÆäËü
- ³¬µÍ½éÖÊËðºÄ
- µÍ½éÖÊËðºÄ
- µþ²ãĸÅÅÓþøÔµ½ºÄ¤
- CEM-1
- CEM-3, CEM-3.1
- PTFE Type
- ÈȹÌÐÔÊ÷Ö¬Ìåϵ
- Ó²ÖʾÛõ£ÑÇ°·²ÄÁÏ
- °ëÄÓÐÔ²ÄÁÏ
- ÌØÖÖÕ³ºÏ²ÄÁÏ
- ÖеȽéÖÊËðºÄ
- ÂÁ»ù°å
- Í»ù°å
- ÄÓÐÔ¸²Í°å
- ¸²¸ÇĤ
- ½ºÄ¤
- ²¹Ç¿°å
- ³£¹æFR-4.0
- ÎÞǦ¼æÈÝFR-4.0, FR-15.0
- ÎÞ±ÎÞǦ¼æÈÝFR-4.1, FR-15.1
- IC Substrate
- Í¿Ê÷֬Ͳ
- ̼ÇâϵÁвúÆ·
- µ¼ÈÈFR-4.0
- Æû³µ²úÆ·
- ÖÇÄÜÖն˲úÆ·
- ³£¹æ¸ÕÐÔ²úÆ·
- Æû³µ²úÆ·
- ÉäƵÓë΢²¨²ÄÁÏ
- ½ðÊô»ù°åÓë¸ßµ¼ÈȲúÆ·
- IC·â×°²úÆ·
- ÈíÐÔ²ÄÁϲúÆ·
- ¸ßËÙ²úÆ·
- ÌØÖÖ²úÆ·
ÊäÈë¹æ¸ñֵɸѡ
²úÆ·Áбí
- ²úÆ·Ãû³Æ
- ²úÆ·¼òÒªÃèÊö
- CTI
- Èȵ¼ÂÊ£¨W/m¡¤K£©
- Df/10GHz
- Dk/10GHz
- Ó¦ÓÃÁìÓò
- Dk
- Df
- CTE
- Tg
- Td
- Synamic9GN
- ¸ßËÙµç·Óü«µÍËðºÄ£¬¸ßÄÍÈȲ㣬ÎÞ±¶à²ã²ãѹ°åÓòÄÁÏ
- --
- --
- --
- --
- 3.34
- 0.0014
- --
- --
- --
- Synamic 6GX
- ¸ßËÙµç·Óõͽéµç³£Êý£¬³¬µÍ½éÖÊËðºÄ£¬ÎÞ±£¬¸ßÄÍÈȲãѹ°å²ÄÁÏ
- --
- --
- --
- --
- 3.73
- 0.0050
- --
- --
- --
- Synamic 6
- ¸ßËÙµç·Óõͽéµç³£Êý£¬³¬µÍ½éÖÊËðºÄ£¬¸ßÄÍÈȲãѹ°å²ÄÁÏ
- --
- --
- --
- --
- 3.68
- 0.0036
- --
- --
- --
- Synamic 6N
- ¸ßËÙµç·Óõͽéµç³£Êý£¬³¬µÍ½éÖÊËðºÄ£¬¸ßÄÍÈȲãѹ°å²ÄÁÏ
- --
- --
- --
- --
- 3.35
- 0.0021
- --
- --
- --
- Synamic8G
- ¸ßËÙµç·Óü«µÍËðºÄ£¬¸ßÄÍÈȲ㣬ÎÞ±¶à²ã²ãѹ°åÓòÄÁÏ
- --
- --
- --
- --
- 3.66
- 0.0032
- --
- --
- --
- Synamic8GN
- ¸ßËÙµç·Óü«µÍËðºÄ£¬¸ßÄÍÈȲ㣬ÎÞ±¶à²ã²ãѹ°åÓòÄÁÏ
- --
- --
- --
- --
- 3.28
- 0.0019
- --
- --
- --